Copper Electroplating Intermediates
Copper Electroplating Intermediates
| Product name | CAS NO. | Detailed |
|---|---|---|
| N,N,N',N'-Tetrakis (2-hydroxypropyl) ethylenediamine（EDTP） | 102-60-3 | Detailed |
| 3-S-Isothiuronium propane sulfonate（UPS） | 21668-81-5 | Detailed |
| 3-mercapto-propyl sulfonic acid, sodium salt（MPS） | 17636-10-1 | Detailed |
| BA | Detailed | |
| PE-2 | Detailed | |
| HGS | Detailed | |
| Polyether compound（AP-14） | Detailed | |
| BZ | Detailed | |
| Bis-(sodium sulfopropyl)-disulfide（SPS） | 27206-35-5 | Detailed |
